标题： 高速互连的设计与测试用于超导多芯片模块 显示英文标题

标题： Design and testing of high-speed interconnects for Superconducting multi-chip modules

摘要： 超导单磁通量子（SFQ）电路可以以极高的速度处理信息，范围可达数百GHz。 SFQ电路基于约瑟夫森结单元进行开关逻辑，并通过弹道传输来传递SFQ脉冲。 多芯片模块（MCM）常用于实现更大更复杂的系统设计，这些设计无法装入单个芯片。 我们优化了宽频互连的设计，用于翻转芯片MCM中的芯片间信号和SFQ脉冲传输，并评估了几种设计参数的重要性，如芯片上的焊盘几何形状、无源微带线（MSL）的长度、MSL中的拐角数量以及磁通捕获和制造效应对MCM操作裕度的影响。 已经设计了几个测试电路来评估上述特性，并在4.5 kA/cm² HYPRES工艺框架内进行了制造。 MCM用于电气连接的凸点使用晶圆级电镀工艺沉积。 我们发现，在优化配置下，具有芯片间连接的MCM测试电路——环形振荡器的最大工作频率接近100 GHz，并且不受MCM互连存在的显著影响，与没有芯片间连接的相同电路相比，仅下降约3%。 显示英文摘要

摘要： Superconducting single flux quantum (SFQ) circuits can process information at extremely high speeds, in the range of hundreds of GHz. SFQ circuits are based on Josephson junction cells for switching logic and ballistic transmission for transferring SFQ pulses. Multi-chip modules (MCM) are often used to implement larger complex designs, which cannot be fit onto a single chip. We have optimized the design of wideband interconnects for transferring signals and SFQ pulses between chips in flip-chip MCMs and evaluated the importance of several design parameters such as the geometry of bump pads on chips, length of passive micro-strip lines (MSL)s, number of corners in MSLs as well as flux trapping and fabrication effects on the operating margins of the MCMs. Several test circuits have been designed to evaluate the above mentioned features and fabricated in the framework of 4.5-kA/cm2 HYPRES process. The MCMs bumps for electrical connections have been deposited using the waferlevel electroplating process. We have found that, at the optimized configuration, the maximum operating frequency of the MCM test circuit, a ring oscillator with chip-to-chip connections, approaches 100 GHz and is not noticeably affected by the presence of MCM interconnects, decreasing only about 3% with respect to the same circuit with no inter-chip connections.