标题： IGBT模块中焊层退化和温度监测的虚拟传感 显示英文标题

标题： Virtual Sensing for Solder Layer Degradation and Temperature Monitoring in IGBT Modules

摘要： 监测绝缘栅双极晶体管（IGBT）模块的退化状态对于确保电力电子系统的可靠性和使用寿命至关重要，尤其是在安全关键和高性能应用中。 然而，由于内部组件的物理不可达性和恶劣环境，直接测量关键退化指标——如结温、焊料疲劳或分层——仍然具有挑战性。 在此背景下，基于机器学习的虚拟传感提供了一个有前景的替代方案，通过从可行的传感器布置到相关但不可达的位置之间建立桥梁。 本文探讨了基于有限数量的物理传感器估计焊料层退化状态以及相应完整温度图的可行性。 基于特定退化模式的合成数据，我们获得了退化焊料区域估计的高精度（1.17%的平均绝对误差），并且能够以最大相对误差4.56%（对应平均相对误差0.37%）再现IGBT的表面温度。 显示英文摘要

摘要： Monitoring the degradation state of Insulated Gate Bipolar Transistor (IGBT) modules is essential for ensuring the reliability and longevity of power electronic systems, especially in safety-critical and high-performance applications. However, direct measurement of key degradation indicators - such as junction temperature, solder fatigue or delamination - remains challenging due to the physical inaccessibility of internal components and the harsh environment. In this context, machine learning-based virtual sensing offers a promising alternative by bridging the gap from feasible sensor placement to the relevant but inaccessible locations. This paper explores the feasibility of estimating the degradation state of solder layers, and the corresponding full temperature maps based on a limited number of physical sensors. Based on synthetic data of a specific degradation mode, we obtain a high accuracy in the estimation of the degraded solder area (1.17% mean absolute error), and are able to reproduce the surface temperature of the IGBT with a maximum relative error of 4.56% (corresponding to an average relative error of 0.37%).